- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/6595 - Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
Patent holdings for IPC class H01R 13/6595
Total number of patents in this class: 81
10-year publication summary
|
5
|
13
|
12
|
12
|
11
|
9
|
4
|
8
|
4
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1034 |
13 |
| Molex, LLC | 1792 |
11 |
| Advanced Connectek Inc. | 338 |
8 |
| TE Connectivity Solutions GmbH | 2580 |
4 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
3 |
| International Business Machines Corporation | 60644 |
2 |
| Intel Corporation | 45621 |
2 |
| Robert Bosch GmbH | 40953 |
2 |
| FCI Americas Technology LLC | 372 |
2 |
| HARTING Electric GmbH & Co. KG | 437 |
2 |
| Samsung Electronics Co., Ltd. | 131630 |
1 |
| Apple Inc. | 50209 |
1 |
| Sumitomo Electric Industries, Ltd. | 14131 |
1 |
| Mitsubishi Electric Corporation | 43934 |
1 |
| Dell Products L.P. | 11144 |
1 |
| HTC Corporation | 2219 |
1 |
| Tyco Electronics UK Limited | 489 |
1 |
| Tyco Electronics (shanghai) Co. Ltd. | 759 |
1 |
| Omron Corporation | 6968 |
1 |
| Molex Incorporated | 609 |
1 |
| Other owners | 22 |